Hybrid backplane assemblies using mixed termination methods are becoming increasingly more popular in the high speed Datacom, telecom and storage markets.
This has driven ABSI investment and capabilities beyond the traditional core competency of press. (compliant pin) assemblies.
With the addition of high speed surface mount products like PCIe (GEN2 & GEN3) to compliant backplanes we are able to leverage our knowledge of laminate materials, vertically integrated connectors supply chain as well as our manufacturing and test capabilities to provide superior product and accelerated time to market.
Contact Amphenol BSI to learn more about our engineering and manufacturing services that are configured to support our product lifecycle from Vision to Volume.
