ABSI Delivering High Speed Backplanes up to 112 Gb/s - Amphenol-BSI Ltd

ABSI Delivering High Speed Backplanes up to 112 Gb/s

ABSI – 112 Gb/s Backplane Technology Solution

Amphenol Backplane & System Integration are excited to introduce our new 112Gb/s Interconnect solution using traditional Backplane technology.

  • Amphenol now offer to design, manufacture and test PCB/Backplane’s up to 112Gb/s Pam4 & PCI Gen 6. This can be achieved by leveraging Amphenol’s PCB & Connector technologies underpinned by ABSI unique design, assembly and test solutions.
  • We can achieve a total channel length of 20” which will produce a Backplane with panel dimensions of 48” x 24” (1219mm x 612mm).
  • Our simulations are available to review, and we will present electrical samples to the market in Q3, 2024.

Datasheet 112G Backplane June 2024

ABSI – 112 Gb/s Backplane Technology Solution
High Speed backplane and midplane

High Speed backplane and midplane

  • Assembling Backplane Systems for >30 years
  • Globally distributed manufacturing
  • Proactive program management
  • Continuous flow (CFL) manufacturing (Low Handling)
  • Computerized light placement eliminates defects
  • Large format expertise with capabilities to 24″ x 60“
  • Advanced Mechanical / Electrical / SI test capability
  • Comprehensive engineering approach from design to production

Wide range of test capabilities

  • Flying Probe/AOI testing for proto/small volume build
  • ICT and functional testing for high volume build
  • Automated Optical Inspection
  • 2D X-ray
  • EEPROM Programming
  • Custom dedicated SI & TDR Test Support
Wide range of test capabilities

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