Division Headquarters Technology Center
Amphenol BSI Ltd
The Mill Enterprise Hub
Newtown Link road
Co Louth
A92 CD3D

Press and Test


Higher Speed Copper Backplanes require increasingly sophisticated assembly and test solutions to efficiently produce high yield assemblies and to be able to test these systems at speed ensuring that they not only perform at power up but also when tomorrows upgrade cards are installed.


Amphenol BSI collaborates with key equipment partners to ensure that press and test solutions are developed and in place to intercept PCB and Interconnect roadmaps.

Other Technologies in Press and Test

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