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Division Headquarters Technology Center
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Amphenol BSI Ltd
The Mill Enterprise Hub
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Greenhills
Drogheda
Co Louth
A92 CD3D

Ultraspeed Backplanes

Amphenol introduces the first integrated PCB-based passive solution to support data rates up to 56 Gb/s NRZ–UltraSpeed. We have developed the next-generation high-speed systems solutions by combining our industry-leading expertise in PCBs, connectors, and backplane assembly techniques and processes.

TARGETED PERFORMANCE: 56 GB/S+

 

Amphenol’s UltraSpeed technology enables our customers to reach these speeds using traditional architecture.

 

HIGH SPEED ENABLING TECHNOLOGY

 

UltraSpeed utilizes three Amphenol areas of expertise to reach 56 Gb/s+

  • PCB: Best-in-class materials and enhanced processes (Registration, Bonding, Etching, Back-drill, Plating)
  • Connector: Lowest crosstalk, best linearity in the industry
  • Backplane Assembly: Nano-compliant press capability and advanced high speed test processes

 

RESULTING PERFORMANCE

 

UltraSpeed benefits users by providing high-speed solutions in traditional architecture systems with:

  • The first OIF-compliant PWB-based BP channel to support 56 Gb/s NRZ
  • 27” Megtron 7 UltraSpeed channel (17” BP and two 5” paddle cards)
  • Paladin Interconnect: Amphenol’s latest backplane interconnect solution
  • UltraSpeed Backplane Assemblies: assembled and tested to deliver performance

EXAMPLES OF CHANNEL PERFORMANCE IMPROVEMENT UTILIZING ULTRASPEED
46″ channel running 25 Gb/s NRZ – (36″ BP and two 5″ paddle cards)
56 G PAM4 uses the same bandwidth as 25 G NRZ

Other Products in Custom Backplanes

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