ABSI Delivering High Speed Backplanes up to 224 Gb/s

ABSI – 112 Gb/s & 224 Gb/s Backplane Technology Solution

Amphenol Backplane & System Integration are excited to introduce our new 112Gb/s Interconnect solution using traditional Backplane technology.

• Amphenol now offer to design, manufacture and test PCB/Backplane’s up to 112Gb/s Pam4 & PCI Gen 6. This can be achieved by leveraging Amphenol’s PCB & Connector technologies underpinned by ABSI unique design, assembly and test solutions.
• We can achieve a total channel length of 20” which will produce a Backplane with panel dimensions of 48” x 24” (1219mm x 612mm).
• Our simulations are available to review, with electrical samples available.
• ABSI are currently developing our new 224GB/s Interconnect solutions using traditional Backplane technology.  Simulations and Test reports will be available to share with our partners in 2026.

Datasheet 112G Backplane June 2024

Wide range of test capabilities

• Flying Probe/AOI testing for proto/small volume build
• ICT and functional testing for high volume build
• Automated Optical Inspection
• 2D X-ray
• EEPROM Programming
• Custom dedicated SI & TDR Test Support