Component Management - Amphenol-BSI Ltd

Component Management

Backplane / Midplane Test

  • Wide range of test capabilities:
  • Flying Probe/AOI testing for proto/low to medium volume builds.
  • Continuity & Isolation (Level II), ICT (Level III) and functional testing for high volume build.
  • Automated Optical Inspection
  • Automated / manual 2D X-ray
  • EEPROM Programming & Verification
  • Custom dedicated SI & TDR Support

With SI margins and Mechanical constraints getting smaller, test is becoming more critical as part of the Assembly requirement to ensure product goes into the field operational ready and is capable of deploying next gen upgrades.

  • More Efficient Test set-up’s
  • Higher accuracy AOI and higher resolution X-ray Imaging required to ensure assembly reliability
  • VNA and TDR for Dedicated SI requirements
  • Testing for Bent Pins / Backdrill / Stub control
  • Automated Impedance Testing
Backplane / Midplane Test

Robotic backplane fixtureless test.
Test capabilities for proto / production builds.
The only testers developed specially for backplanes.
Tests double sided boards
0.65 x 1.4 m standard
up to 1 x 1.4 m (stretch)


  • Combined Electrical test & AOI in one machine.
  • Level II Test – Continuity & Isolation


  • Combined X-ray & AOI in one machine.
  • Color Automatic Optical Inspection.
  • High resolution Automatic 2D transmission X-ray.

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